Compliance |
COM Express® Basic, Pin-out Type 6 |
Dimensions (H x W x D)
| 125 x 95 mm |
| CPU
| Intel® Xeon® E3-1515M Intel® Xeon® E3-1505M Intel® Xeon® E3-1505L Intel® Core™ i7-6820EQ Intel® Core™ i7-6822EQ Intel® Core™ i5-6440EQ Intel® Core™ i5-6442EQ Intel® Core™ i3-6100E Intel® Core™ i3-6102E Intel® Celeron™ G3900E Intel® Celeron™ G3902E |
| Chipset |
Intel® Mobile CM236 / Intel® Mobile QM170 (Core™ i5 & Core™ i7)
|
| Main Memory |
2x DDR4-2133 SO-DIMM up to 2x 16 GByte (non-ECC/ECC)
|
| Graphics Controller |
Intel® Iris™ Pro Graphics P580 (GT4e), Intel® HD Graphics P530 (GT2) Intel® HD Graphics P510 (GT1) |
| Ethernet Controller |
Intel® I219LM |
| Ethernet |
10/100/1000 MBit Ethernet |
| Hard Disk |
4x SATA 6Gb/s |
| Flash Onboard |
- |
| PCI Express / PCI support |
8x PCIe x1, 1x PEG x16 |
| Panel signal |
DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: - LVDS: Dual Channel 18/24bit |
| USB |
4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 |
| Serial |
2x serial interface (RX/TX only) |
| Audio |
Intel® High Defi nition Audio |
| Common Features |
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| BIOS |
AMI Aptio V |
| Humidity |
93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Features On Request |
eDP instead of LVDS, VGA,Intel® Mobile HM170 Chipset vPRO (AMT/TXT/AES Support)
|
| Power Management |
ACPI 4.0, S5 Eco
|
| Power Supply
| 8.5v - 20v Wide Range ATX, Single Supply Power |
| Special Features |
POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane confi guration by Setup Option
|
| Operating System |
Windows® 10, Windows® 8.1, Windows® 7, WEI8, WE8S, WES7, Linux, VxWorks |
| Temperature |
Commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating
Extended temperature: -25° C to +75° C operating, -30° C to +85° C non-operating
|
| Supported Modules |
COMe-bSL6 xx-xxxxxx CM236/QM170 | |
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