Computer On Modules
Mother boards
HMI & Displays
Industrial PC
HCP-72i1
HCP-72i1 HybridTCA™ Communication Platform with 2 x86 CPU Blades and 3 I/O Blades
  • High Availability, Full Redundancy and Extreme High Performance
  • 2 x86 CPU Blades in the rear, each blade support Ivy-Bridge E5-2600 v2 Family up to 130W CPU
  • Dual Mainboard Communication is through NTB port up to 20 Gbs bi-way
  • Each Blade Support 16x R-DIMM
  • 3 Hot-swappable I/O Blades on the front
  • IPMI Port for Remote Management
  • Removable Fan Module
  • NEBS Ready Design
  • 2 x 2.5" HDD Bay
  • Hinge LCD Module for Easy Diagnostics and Configuration
 
 

Platform

CPU 4x Intel® Xeon® processor E5-2600 v2 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)
Chipset Intel C604 Chipset
BIOS AMI BIOS 64Mb
Memory Technology Quad-channel DDR3 1066/1333/1600 MHz (Registered or unbuffered, Ecc or non-ECC)
Memory Capacity 512GB (Registered) or 128 GB (Unbuffered)
Memory Socket 16 x 240-pin R-DIMM

Storage

SATA storage 2 x 2.5” HDD/SSD kit

I/O

Ethernet controller Intel 82576EB or 82599ES
Default LAN IPMI x1, Management Port x1
Max LAN 36 copper GbE ports or 24 10 GbE SFP+ ports
Bypass Gen.2 Bypass (NCM-BPGC01A)
Console RJ-45 x1
Management ports RJ-45 x1
Security acceleration Intel Cave Creek 8910
USB 2.0 1 x USB 2.0 x Type A
IPMI via OPMA slot 1

Power and Mechanical

Reset Yes
Processor cooling 4x CPU heatsink with fan duct
Fan cooling 5 x independent hot-swappable cooling Fans with smart fan control
Hardware monitor Yes

OS and Certifications

Operating System Windows Server 2003, 2008, Linux Kernel 2.6 or above
Certifications CE Class A, FCC Class A, UL, C-Tick, VCCI
Compliance RoHS

Physical and Environmental

Operating temperature 0°C to 40°C
Operating humidity 5% to 95% (non-condensing)
Storage humidity 5% to 95% (non-condensing)
Dimensions (W x H x D) 431 mm x 88 mm x 718.1 mm (16.81" x 3.43" x 28.01")
Weight 35 kg (77 lbs)
LCD module 128 x 64 text LCM with keypad
Watchdog Yes
Internal RTC Yes
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